For structures that are exposed to high temperature changes, it is essential to know the thermal expansion of the materials used. In this way, measures can be taken to avoid induced stresses. As the coefficient of thermal expansion (CTE) changes with the temperature, we cool the samples in our setups down to -263°C (10K) and heat them up to 200°C.

Round and flat samples of various dimensions as well as structures can be tested by either cooling them directly with liquified nitrogen and helium or by vacuum isolating and radiation cooling the specimens. Capacitive sensors or laser interferometers measure the change in length. By conducting measurements in different dimensions, structures and anisotropic materials can be characterized. The thermal expansion of structural elements like cables, tapes and fabrics can be determined by change of sagging.

To develop liquified gas storage solutions or predict temperature distribution in a structure early in the design process, the thermal conductivity of the materials used must be known. As this characteristic varies greatly at different temperatures, we can use our setup to determine the thermal conductivity at temperatures between -263°C (10K) up 17°C.

To reach such low temperatures, the setup is vacuum isolated. The setup is highly adaptable and can be modified for different sample geometries up to a length of 300 mm and a diameter of 50 mm and for good or poor thermal conducting (e.g. insulation) materials.

After the design of complex systems and subsystems, it can be complicated to verify the results of thermal deformation FEM modeling. By combining our expertise in temperature control down to cryogenic temperatures, the design and manufacture of customized setups and the high measurement accuracy of distance changes, as with our CTE and CME setups, we can determine the thermal deformation of complex structures. For example, we can measure the displacement of sensitive optical elements on a structure depending on homogeneous and nonhomogeneous temperature changes and environmental conditions.

To control temperature and environmental conditions, we can utilize our infrastructure of thermal and vacuum chambers and thus operate in a temperature range between -263°C (10K) and 500 °C

To be able to predict not only the temperature distribution in a component made of one material but also in systems made of different materials, structures and interfaces, the heat transfer in the relevant interfaces must also be determined.

With our thermal contact conductance setup, the heat conduction of mechanical interfaces can be characterized. Heat transfer depending on materials, surface condition, environment and interlayer material as well as the influence of homogeneous surface pressure versus typical screwed connection can be examined.

An electrical heater and a cooled heat sink generate a temperature difference. Parallel heat flux is reduced with baffles.